Development Programs

These are previous programs and technologies developed by TAI over its history. Please note that at present, TAI does not manufacture and/or sell any of these technologies as products. While we can assist you with various aerospace, laboratory and commercial thermal management applications, we no longer pursue these technologies or services which are heavily focused in the oil and gas, energy or cryogenics industries (with the exception of our copper thermal straps).

To learn more about our previous development programs, visit our sister company (the research and R&D branch of TechApps), www.TAI-Inc.us

 

CryoSpheres™ Insulation Panels (CIP)

 

Microsphere Insulation Panels (MIP)CryoSpheres™ Insulation Panel (CIP) technology provides a low-cost, high-efficiency insulation system for the transfer and storage of cryogens and cryogenic propellants. Applications include space launch and support equipment, industrial liquefied gas production, scientific research facilities, and a broad range of high-performance thermal insulation and protection systems.

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Polyethylene Flexible Cryostat for HTS & LNG

 

Polyethylene Flexible Cryostat for HTS & LNGTechnology Applications, Inc. (TAI) has developed a new material use that reduces the initial procurement and recurring maintenance costs and to improve reliability issues for flexible cryostats used for high temperature superconductors and liquid natural gas transfer lines.



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In-Home Oxygen Liquifier for Medical Applications

 

Gas Liquefier System (GLS)This gas liquefier system was developed by TAI to liquefy oxygen for medical health care use. This system incorporates a compact and portable design for household use.


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Cooling Interface Systems

 

Cooling Interface SystemsTAI designs and fabricates custom cooling interface systems for cooling of critical system components for space, flight, and ground based applications.



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Electronics Cooling Systems

 

Electronics Cooling SystemsTAI designs and fabricates custom electronics cooling systems for cooling of critical system components. Applications include telecommunications, radar, and chips or curcuit boards.



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Thermal Control Vibration Isolation System (TCVIS)

 

Thermal Control Vibration Isolation System (TCVIS)Demonstrated two innovative tactical cryocooler technologies: vibration cancellation and high-performance graphite thermal straps.



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Cryocooler Interface System (CIS)

 

Cryocooler Interface System (CIS)Feasibility proved for distributed cooling across a gimbal interface.



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