WHY CHOOSE TAI?
Technology Applications, Inc. (TAI), founded in 1994 and located in Boulder, Colorado, specializes in advanced technology development of thermal management systems for the DoD, NASA, ESA, JAXA, aerospace prime contractors, national laboratories, universities, and commercial firms across the globe. Our expertise and specialty products include vibration isolation, remote (distributed) cooling, high-conductance graphite fiber thermal straps, copper thermal straps, carbon and aluminum straps, and thermal management of electronic components and enclosures.
TAI offers unique capabilities for design, analysis, and prototype development to meet specific thermal management system requirements. We have over 5,000 square feet of design, manufacture, test facilities, and office space located near many high technology government/industry labs and their supporting infrastructure of companies.
Quality | Customer Service | Affordability | In-House Design and Fabrication
At TAI, we live by these standards; it's how we've earned our reputation, developed the highest quality, most affordable thermal straps on the market, and expanded our strap business so rapidly over the last 6 years. Beyond our high quality and affordable pricing, it's our unparalleled customer service, efficiency, and the availability of our engineers and thermal strap experts, that sets TAI apart.
All of our thermal strap products are assembled right here, at our facility, by several, highly-trained thermal strap assembly experts---in our assembly labs and clean room. We will never outsource your thermal straps from other companies or electrical component manufacturers in the US or Asia, nor will we ever outsource strap assembly to any third party.
Thermal Strap Programs
...A small sampling of the hundreds of spaceflight, airborne, and ground-based/terrestrial programs using our straps:
...Just a handful of the organizations that we've worked with & routinely use our thermal strap products:
|US Air Force||Department of Energy||US NAVY||Department of Defense||NIST|
|Lockheed Martin||Airbus Space & Defense||Raytheon||Honeywell||BAE Systems|
|General Atomics||Ball Aerospace||Orbital ATK||Thales Alenia||SSTL (Surrey Satellite)|
|L3||Kayser-Threde||OHB||Harris Corp.||Selex Galileo|
|US Naval Research Lab||SLAC||ESRF||CERN||ABB|
|Sandia Labs||Jefferson National Lab||Diamond Light Source||Fermi National Lab||Lawrence Berkeley Lab|
|Argonne National Lab||Oak Ridge National Lab||Lawrence Livermore Lab||Los Alomos National Lab||Brookhaven National Lab|
|Max Planck Institute||LNLS||Northrop Grumman||Duke||JANIS|
|University of Wisconsin||University of N. Carolina||Berkeley||
|University of Michigan||University of Granada||Oxford||University of Florida||University of Glasgow|
|North Carolina State U.||TNO||Yale||AAO||U. of Pennsylvania|
|Linde||JHU Applied Physics Lab||PTB||University of Bordeaux||NDT Global|